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HomeHome & OfficeTools & Home ImprovementWelding & SolderingSoldering & Brazing EquipmentParts & AccessoriesBrazing KitsFor MTK MSM Samsung Huawei Xiaomi IPad CPU RAM PM Power
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EGP 455.23
EGP 782.7342%
In stock
Delivery fees from EGP 171.57 to 6th of October.
Save 10 EGP on shipping with prepaid payment
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Delivery & Returns
Shipped from abroad
Choose your location
Door Delivery
Delivery Fees EGP 171.57
Delivery by 01 July when you order within next 8hrs 41mins
Return Policy
Free return within the legal return period from 14 to 30 days, and if they meet the terms & conditions, with the need to report any apparent defect within 48 hours. For more details about return policy.Details
Warranty
None
Seller Information
JG-Sunnyshy
86%Seller Score
88 Followers
Seller Performance
Order Fulfillment Rate: Excellent
Quality Score: Excellent
Customer Rating: Average
Product details
The following is a detailed introduction about our products:
Name:4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin Direct Heat Template
The product is new and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Item Type: BGA Reballing Stencil
Colour: silver
Material: stainless steel
Package Contents:
4 x BGA Reballing Stencils
Only the above package content, other products are not included.
Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.
About Us
We provide the good product with the best price,we support Wholesale/Drop Shipping Order
1. For Drop Shipping order, please remark"dropshipping order", we will prioritize it.
2. For Wholesale/Drop Shipping orders, if you have any ideas about the price or package,please contact us in advance,we will give you the best service to satisfy your demands.
About Shipments
1.We will send out the orders ASAP once your payment is completed normally.
2.Please write your complete delivery address with correct phone number and zip code, especially please confirm your full name.
About After-sale Service
We are reliable seller and we have our professional after-sale service for all of our customs. If there is any question about the order,please contact us in advance ,we will always here until you get a happy answer.
About Feedback
1. Please check the package and item when you get carefully to make sure there is no problem.
2. If you have any problem or are not entirely satisfied with your package,please don’t be hesitate to contact us first before leaving negative feedback. We will resolve the problem to satisfy you.
3. If there is no problem, please leave us five star positive feedback.
Your affirmation is our greatest motivation ! !
Name:4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin Direct Heat Template
The product is new and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Item Type: BGA Reballing Stencil
Colour: silver
Material: stainless steel
Package Contents:
4 x BGA Reballing Stencils
Only the above package content, other products are not included.
Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.
About Us
We provide the good product with the best price,we support Wholesale/Drop Shipping Order
1. For Drop Shipping order, please remark"dropshipping order", we will prioritize it.
2. For Wholesale/Drop Shipping orders, if you have any ideas about the price or package,please contact us in advance,we will give you the best service to satisfy your demands.
About Shipments
1.We will send out the orders ASAP once your payment is completed normally.
2.Please write your complete delivery address with correct phone number and zip code, especially please confirm your full name.
About After-sale Service
We are reliable seller and we have our professional after-sale service for all of our customs. If there is any question about the order,please contact us in advance ,we will always here until you get a happy answer.
About Feedback
1. Please check the package and item when you get carefully to make sure there is no problem.
2. If you have any problem or are not entirely satisfied with your package,please don’t be hesitate to contact us first before leaving negative feedback. We will resolve the problem to satisfy you.
3. If there is no problem, please leave us five star positive feedback.
Your affirmation is our greatest motivation ! !
Specifications
Key Features
- for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power Heat Template
- BGA Stencil
- for MTK MSM
- BGA Direct Heat Template
- BGA Stencil for MTK MSM
- 4PCS Universal BGA Stencil
What’s in the box
4 x BGA Reballing Stencils
Specifications
- SKU: GE810IP093L3RNAFAMZ
- Model: BGA Stencil
- Production Country: China
- Size (L x W x H cm): 19.5x10x0.5
- Color: silver
- Main Material: stainless steel
- Warranty Address: None
Verified Customer Feedback
This product has no ratings yet.
/product/15/283863/1.jpg?3079)
For MTK MSM Samsung Huawei Xiaomi IPad CPU RAM PM Power
EGP 455.23
EGP 782.7342%