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Multifunction BGA Stencil 0.3/0.35/0.4/0.5/Parallel/45 Degree Hole Universal Solder Template BGA Reballing Stencil

EGP 492.48
EGP 686.8828%

In stock

Delivery fees from EGP 147.74 to 6th of October. Save 10 EGP on shipping with prepaid payment
Variation available

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Pickup Station

Delivery Fees EGP 147.74
Pickup by 04 July when you order within next 19hrs 57mins

Door Delivery

Delivery Fees EGP 182.74
Delivery by 04 July when you order within next 19hrs 57mins

Return Policy

Free return within the legal return period from 14 to 30 days, and if they meet the terms & conditions, with the need to report any apparent defect within 48 hours. For more details about return policy.Details

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Order Fulfillment Rate: Very Poor

Quality Score: Excellent

Product details

Model Number: CPU BGA Reballing ​Stencil
Applicaiton:for Android Phone Repair
Thickness:0.12MM

Material:steel
colour:silver

Package Contents:
1 * BGA Stencil

Only the above package content, other products are not included.
Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.

Specifications

Key Features

Stencil

What’s in the box

N/A

Specifications

  • SKU: GE810SN1N47KHNAFAMZ
  • Product Line: Generic
  • Model: N/A
  • Production Country: China
  • Size (L x W x H cm): 10x10x5
  • Color: Multi
  • Main Material: N/A
  • Care Label: N/A
  • Certifications: Fair Trade
  • From the Manufacturer: N/A
  • Shop Type: Jumia Mall
  • Warranty Address: N/A

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Multifunction BGA Stencil 0.3/0.35/0.4/0.5/Parallel/45 Degree Hole Universal Solder Template BGA Reballing Stencil

Multifunction BGA Stencil 0.3/0.35/0.4/0.5/Parallel/45 Degree Hole Universal Solder Template BGA Reballing Stencil

EGP 492.48
EGP 686.8828%

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